Title :
Characterization and processing of low dielectric constant thick film substrates for MCM-C modules
Author :
Kellerman, Dave ; Nabatian, David J. ; Bokalo, Peter ; He, Feng ; Retherford, Larry ; Elshabini, Aicha ; Barlow, Fred
Abstract :
The application of a new microsphere low K thick film material to large MCM-C substrates is discussed in this paper. Processing of large ceramic boards approximately 6.5×8.5 in2 with 4 metal layers is described. Both screen printed and etched silver and gold metallizations are used for this work. The electrical, physical, and materials characterization of both silver and gold compatible multilayer low K dielectric material is detailed. High frequency characterization of the material is also discussed over a wide frequency bandwidth between 1-12 GHz
Keywords :
ceramics; etching; hybrid integrated circuits; integrated circuit metallisation; microwave integrated circuits; multichip modules; permittivity; thick film circuits; 1 to 12 GHz; 6.5 in; 8.5 in; Ag; Au; MCM-C; MCM-C modules; MCM-C substrates; electrical characterization; etched gold metallization; etched silver metallization; frequency bandwidth; high frequency characterization; large ceramic board processing; low dielectric constant thick film substrates; materials characterization; metal layers; microsphere low K thick film material; multilayer low K dielectric material; physical characterization; screen printed gold metallization; screen printed silver metallization; Ceramics; Dielectric constant; Dielectric materials; Dielectric substrates; Etching; Frequency; Gold; Metallization; Silver; Thick films;
Conference_Titel :
Multichip Modules and High Density Packaging, 1998. Proceedings. 1998 International Conference on
Conference_Location :
Denver, CO
Print_ISBN :
0-7803-4850-8
DOI :
10.1109/ICMCM.1998.670780
