DocumentCode
2851868
Title
New low cost interconnection materials for high frequency MCM applications
Author
Keusseyan, R.L. ; Amey, D.I. ; Horowitz, S.J.
Author_Institution
Dupont Electron., Research Triangle Park, NC, USA
fYear
1998
fDate
15-17 Apr 1998
Firstpage
206
Lastpage
211
Abstract
A new “high density” gold thick film technology is introduced. Circuits produced using the new material system exhibit superior fine line definition, conductivity density and high frequency performance. The high frequency performance of etched “high density” gold circuits were found to be superior to etched thin film circuits in the GHz range
Keywords
etching; gold; hybrid integrated circuits; microwave integrated circuits; multichip modules; thick film circuits; Au; conductivity density; etched high density gold circuits; etched thin film circuits; fine line definition; high density gold thick film technology; high frequency MCM applications; high frequency performance; interconnection materials; Conducting materials; Costs; Etching; Frequency; Gold; Metallization; Powders; Sputtering; Thick films; Thin film circuits;
fLanguage
English
Publisher
ieee
Conference_Titel
Multichip Modules and High Density Packaging, 1998. Proceedings. 1998 International Conference on
Conference_Location
Denver, CO
Print_ISBN
0-7803-4850-8
Type
conf
DOI
10.1109/ICMCM.1998.670781
Filename
670781
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