• DocumentCode
    2851878
  • Title

    Dual Metric OPC for Complex SRAF Implementation

  • Author

    Yehia, Ayman

  • Author_Institution
    Mentor Graphics Corp., Cairo
  • fYear
    2007
  • fDate
    16-18 Dec. 2007
  • Firstpage
    253
  • Lastpage
    256
  • Abstract
    Sub-Resolution Assist Feature (SRAF) insertion is one of the most important Resolution Enhancement Techniques (RET) for the 65 nm, 45 nm nodes and beyond. In this paper, we are proposing a novel approach for the optimum placement of SRAF structures using state of the art Calibre RET flow. In this approach, the optimal SRAF shapes are achieved simultaneously during the Optical Proximity Correction (OPC) stage. The main features and the SRAFs are optimized to account for their edge placement and process window metrics respectively. The resulting mask shapes deliver some of the properties that can be obtained using the Inverse Lithography Techniques (ILT), such as excellent Process Window Performance, while there is almost no impact on the runtime. The implemented model-based optimization flow remains compatible with the current OPC production flows.
  • Keywords
    masks; proximity effect (lithography); inverse lithography techniques; mask shape; optical proximity correction; placement process; process window metric; resolution enhancement techniques; subresolution assist feature; Analytical models; Degradation; Flow production systems; Graphics; Immunity testing; Lithography; Optical attenuators; Optimized production technology; Runtime; Shape; OPC; Optical Proximity Correction; Process Window; RET; Resolution Enhancement Techniques; SRAF; Sub-Resolution Assist Feature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design and Test Workshop, 2007. IDT 2007. 2nd International
  • Conference_Location
    Cairo
  • Print_ISBN
    978-1-4244-1824-4
  • Electronic_ISBN
    978-1-4244-1825-1
  • Type

    conf

  • DOI
    10.1109/IDT.2007.4437471
  • Filename
    4437471