DocumentCode
2851878
Title
Dual Metric OPC for Complex SRAF Implementation
Author
Yehia, Ayman
Author_Institution
Mentor Graphics Corp., Cairo
fYear
2007
fDate
16-18 Dec. 2007
Firstpage
253
Lastpage
256
Abstract
Sub-Resolution Assist Feature (SRAF) insertion is one of the most important Resolution Enhancement Techniques (RET) for the 65 nm, 45 nm nodes and beyond. In this paper, we are proposing a novel approach for the optimum placement of SRAF structures using state of the art Calibre RET flow. In this approach, the optimal SRAF shapes are achieved simultaneously during the Optical Proximity Correction (OPC) stage. The main features and the SRAFs are optimized to account for their edge placement and process window metrics respectively. The resulting mask shapes deliver some of the properties that can be obtained using the Inverse Lithography Techniques (ILT), such as excellent Process Window Performance, while there is almost no impact on the runtime. The implemented model-based optimization flow remains compatible with the current OPC production flows.
Keywords
masks; proximity effect (lithography); inverse lithography techniques; mask shape; optical proximity correction; placement process; process window metric; resolution enhancement techniques; subresolution assist feature; Analytical models; Degradation; Flow production systems; Graphics; Immunity testing; Lithography; Optical attenuators; Optimized production technology; Runtime; Shape; OPC; Optical Proximity Correction; Process Window; RET; Resolution Enhancement Techniques; SRAF; Sub-Resolution Assist Feature;
fLanguage
English
Publisher
ieee
Conference_Titel
Design and Test Workshop, 2007. IDT 2007. 2nd International
Conference_Location
Cairo
Print_ISBN
978-1-4244-1824-4
Electronic_ISBN
978-1-4244-1825-1
Type
conf
DOI
10.1109/IDT.2007.4437471
Filename
4437471
Link To Document