Multilevel modeling of integrated power harvesting system using VHDL-AMS and SPICE

In this paper, we describe a novel top/down methodology for behavioral and structural modeling of multi domain microsystems. The study case is an integrated power harvesting circuit used for supplying power to nodes in wireless sensor networks. The system includes an analog circuit, a piezoelectric MEMS generator and a storage capacitor. The classical validation of such systems by separate simulation of each element: FEM analysis for mechanical part and traditional circuit-simulators for electrical part does not offer the possibility to predict the behavior of the complete system. To overcome such limitations, we propose to use a simulation environment based on VHDL-AMS and SPICE languages.