DocumentCode :
2852851
Title :
Multi-GHz loopback testing using MEMs switches and SiGe logic
Author :
Keezer, D.C. ; Minier, D. ; Ducharme, P. ; Viens, D. ; Flynn, G. ; McKillop, J.S.
Author_Institution :
Georgia Inst. of Technol., Atlanta, GA
fYear :
2007
fDate :
21-26 Oct. 2007
Firstpage :
1
Lastpage :
10
Abstract :
This paper demonstrates the application of micro-electromechanical switches (MEMs) and SiGe logic devices for passive and active loopback testing of wide data buses at rates up to 6.4Gbps per signal. Target applications include HyperTransport, Fully-Buffered DIMM, and PCIexpress, among others. Recently-commercialized MEMs technology provides high bandwidth (>7GHz) in very small packages in order to support wide parallel buses. SiGe logic also supports >7 Gbps signals when active shaping of the waveform is required. Loopback modules are described with between 9 and 16 differential channels. Multiple cards handle very wide buses or multiple ports. Passive cards utilize MEMs for switching between the Loopback (self-test) mode and traditional ATE source/receiver channels (which are also used for DC parametric tests). It is this switching function that benefits from the MEMs increased density. Active loopback cards provide additional waveform-shaping functions, such as buffering, amplitude attenuation or modulation, deskew, delay adjustment, jitter injection, etc. The modular approach permits pre-calibration of the loopback electronics, and easy reconfiguration between design validation, characterization testing, and high-volume production testing.
Keywords :
Ge-Si alloys; integrated logic circuits; microswitches; system buses; test equipment; MEMs switch; MEMs technology; active loopback card; active loopback testing; active waveform shaping; differential channel; logic device; loopback electronics; loopback module; micro-electromechanical switch; passive loopback testing; switching function; Bandwidth; Data buses; Electronic equipment testing; Germanium silicon alloys; Logic devices; Logic testing; Microswitches; Packaging; Silicon germanium; Switches;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Test Conference, 2007. ITC 2007. IEEE International
Conference_Location :
Santa Clara, CA
ISSN :
1089-3539
Print_ISBN :
978-1-4244-1127-6
Electronic_ISBN :
1089-3539
Type :
conf
DOI :
10.1109/TEST.2007.4437581
Filename :
4437581
Link To Document :
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