• DocumentCode
    2852864
  • Title

    Analyzing and addressing the impact of test fixture relays for multi-gigabit ATE I/O characterization applications

  • Author

    Moreira, Jose ; Barnes, Heidi ; Hoersch, Guenter

  • fYear
    2007
  • fDate
    21-26 Oct. 2007
  • Firstpage
    1
  • Lastpage
    10
  • Abstract
    Relays are some of the most frequently used components on test fixtures for automated test applications. With data-rates of current I/O interfaces already reaching 5 Gbps and beyond in desktop applications and expected to continue to increase, test engineers must make the decision to continue using relays on the high-speed signal lines, or remove the relays from the test fixture signal paths and sacrifice the flexibility they provide. This paper presents some results and guidelines on using relays in test fixtures for 10 Gbps applications. A commercially available relay was selected and integrated into a typical ATE test fixture design. Special consideration was given to the footprint optimization through 3D-EM simulation and the use of passive equalization to compensate for some of the relay losses. The paper concludes with measurements of an experimental test fixture using an ATE system running 10 Gbps.
  • Keywords
    automatic test equipment; automatic test pattern generation; semiconductor relays; 3D-EM simulation; ATE test fixture design; I/O interfaces; automated test applications; bit rate 5 Gbit/s to 10 Gbit/s; footprint optimization; high-speed signal lines; multigigabit ATE I/O characterization applications; passive equalization; relay losses; test fixture relays; test fixture signal paths; Automatic testing; Circuit testing; Costs; Digital relays; Electronic equipment testing; Fixtures; Instruments; Production; Switches; System testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 2007. ITC 2007. IEEE International
  • Conference_Location
    Santa Clara, CA
  • ISSN
    1089-3539
  • Print_ISBN
    978-1-4244-1127-6
  • Electronic_ISBN
    1089-3539
  • Type

    conf

  • DOI
    10.1109/TEST.2007.4437582
  • Filename
    4437582