• DocumentCode
    2852955
  • Title

    Characterization of NBTI induced temporal performance degradation in nano-scale SRAM array using IDDQ

  • Author

    Kang, Kunhyuk ; Alam, Muhammad Ashraful ; Roy, Kaushik

  • Author_Institution
    Purdue Univ., West Lafayette, IN
  • fYear
    2007
  • fDate
    21-26 Oct. 2007
  • Firstpage
    1
  • Lastpage
    10
  • Abstract
    One of the major reliability concerns in nano-scale VLSI design is the time dependent negative bias temperature instability (NBTI) degradation. Due to the higher operating temperature and increasing vertical oxide field, threshold voltage (Vt) of PMOS transistors can increase with time under NBTI. In this paper, we examine the impact of NBTI degradation in memory elements of digital circuits, focusing on the conventional 6T SRAM array topology. Using an empirical NBTI model based on the reaction diffusion (RD) framework, we first examine the impact of NBTI degradation in critical performance parameters of SRAM array. These parameters include (1) static noise margin (SNM), (2) statistical read & write stability, and (3) standby leakage current (IDDQ). We show that due to NBTI, read stability of SRAM cell degrades, while write stability and standby leakage improve with time. Furthermore, using specific time trend of IDDQ degradation, we proposed efficient characterization technique to predict the lifetime behavior of SRAM array under NBTI.
  • Keywords
    SRAM chips; VLSI; integrated circuit design; integrated circuit reliability; leakage currents; nanoelectronics; statistical analysis; PMOS transistors; characterization technique; digital circuits; lifetime behavior prediction; memory elements; nano-scale SRAM array topology; nanoscale VLSI design; negative bias temperature instability degradation; reaction diffusion framework; reliability concerns; standby leakage current; static noise margin; statistical read stability; statistical write stability; temporal performance degradation; vertical oxide field; Degradation; Digital circuits; MOSFETs; Negative bias temperature instability; Niobium compounds; Random access memory; Stability; Threshold voltage; Titanium compounds; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 2007. ITC 2007. IEEE International
  • Conference_Location
    Santa Clara, CA
  • ISSN
    1089-3539
  • Print_ISBN
    978-1-4244-1127-6
  • Electronic_ISBN
    1089-3539
  • Type

    conf

  • DOI
    10.1109/TEST.2007.4437590
  • Filename
    4437590