Title :
Low-cost associative memory
Author :
Mundy, J. ; Burgess, Jonathan ; Joynson, R. ; Neugebauer, C.
Author_Institution :
General Electric Co., Schenectady, N.Y., USA
Abstract :
The design and application of a high density associative memory chip will be discussed. The chip has 512 bits and the cell design utilizes the new MOS varactor bootstrapping technique.
Keywords :
Associative memory; Computer architecture; Concurrent computing; Costs; Distributed computing; Large scale integration; Logic arrays; Parallel processing; Random access memory; Voltage;
Conference_Titel :
Solid-State Circuits Conference. Digest of Technical Papers. 1972 IEEE International
Conference_Location :
Philadelphia, PA, USA
DOI :
10.1109/ISSCC.1972.1155033
