High throughput non-contact SiP testing

Author

Moore, B. ; Sellathamby, C. ; Cauvet, P. ; Fleury, H. ; Paulson, M. ; Reja, M. ; Fu, L. ; Bai, B. ; Reid, E. ; Filanovsky, I. ; Slupsky, S.

Author_Institution

Scanimetrics Inc. RTF, Edmonton, AB

fYear

2007

fDate

21-26 Oct. 2007

Firstpage

1

Lastpage

10

Abstract

A non-contact method for parallel testing of system-in-package (SiP) assemblies is presented. This technology allows for JTAG testing of partially or fully populated SiPs in wafer form, in advance of final packaging. The technology utilizes non-contact GHz short-range, near field communications to transfer bi-directional data to SiP substrates; creating a wireless test access port or WTAP. The system is integrated with a standard probe card to deliver power and wireless signals. The wireless probes convert high frequency RF (GHz) transceiver signals to standard tester ATE logic levels and allow the use of standard probers and JTAG testers. In addition, all transceivers (DUTand probe) use antenna structures and electronics that are fully CMOS compliant. Enhancing the economics of SiP manufacture by enabling parallel non-contact testing of SiPs before packaging is a key benefit of this technology.

Keywords

silicon compounds; system-in-package; CMOS compliant; JTAG testing; SiP; non contact testing; parallel testing; system in package; wafer form; wireless test access; Assembly systems; Bidirectional control; Frequency conversion; Logic testing; Packaging; Probes; Radio frequency; System testing; Throughput; Transceivers;

fLanguage

English

Publisher

ieee

Conference_Titel

Test Conference, 2007. ITC 2007. IEEE International

Conference_Location

Santa Clara, CA

ISSN

1089-3539

Print_ISBN

978-1-4244-1127-6

Electronic_ISBN

1089-3539

Type

conf

DOI

10.1109/TEST.2007.4437595

Filename

4437595