Title :
Impact of Quad Flat No Lead package (QFN) on automated X-ray inspection (AXI)
Author :
Tee Chwee Liong ; Pascual, A.
Author_Institution :
Test Dev. Eng. (Malaysia), Intel Kulim, Kulim
Abstract :
QFN is increasingly being used on wireless cards, handhelds etc. However, QFN unique solder joints pose great challenges for AXI. This paper discusses lack of industry specification for QFN inspection, how AXI methodology was improved to detect QFN solder joint defect, design for inspection and future work.
Keywords :
X-ray applications; design; electronics packaging; inspection; solders; automated X-ray inspection; industry specification; inspection design; quad flat no lead package; solder joint defect detection; Automatic testing; Circuit testing; Electronic packaging thermal management; Electronics packaging; Humans; Inspection; Lead; Packaging machines; Soldering; Thermal conductivity;
Conference_Titel :
Test Conference, 2007. ITC 2007. IEEE International
Conference_Location :
Santa Clara, CA
Print_ISBN :
978-1-4244-1127-6
Electronic_ISBN :
1089-3539
DOI :
10.1109/TEST.2007.4437601
