Title :
Fast and effective fault simulation for path delay faults based on selected testable paths
Author :
Xiang, Dong ; Zhao, Yang ; Li, Kaiwei ; Fujiwara, Hideo
Author_Institution :
Sch. of Software, Tsinghua Univ., Beijing
Abstract :
Test generation and fault simulation of path delay faults are very time-consuming. A new fault simulation method of fully enhanced scan designed circuits is proposed for path delay faults based on single stuck-at tests without circuit transformation. The proposed method identifies robustly and non-robustly testable paths first, for which a selected path circuit (SPC) is constructed. The SPC circuit contains no internal fanouts. Fault simulation of non-robustly testable paths is reduced to 3-valued logic simulation of the SPC circuit. Fault simulation is completed on the SPC circuit by only tracing the active part of SPC circuit. An effective fault dropping technique is also adopted based on the selective tracing scheme. The proposed fault simulation scheme is extended to that of robustly testable path delay faults. Experimental results confirm that the proposed fault simulator is exact. It is shown according to experimental results that the proposed fault simulator gets exact fault simulation results in very short time. Sufficient experimental results are presented to compare with previous methods on CPU time and accuracy.
Keywords :
automatic test pattern generation; fault simulation; logic design; logic simulation; multivalued logic circuits; 3-valued logic simulation; circuit transformation; fault dropping technique; fault simulation; internal fanouts; path delay faults; scan designed circuits; selected path circuit; single stuck-at tests; test generation; testable paths; Central Processing Unit; Circuit faults; Circuit simulation; Circuit testing; Delay effects; Logic circuits; Logic testing; Polynomials; Robustness; Software testing; Fault simulation; non-robust testing; path delay faults; robust testing; selected path circuit;
Conference_Titel :
Test Conference, 2007. ITC 2007. IEEE International
Conference_Location :
Santa Clara, CA
Print_ISBN :
978-1-4244-1127-6
Electronic_ISBN :
1089-3539
DOI :
10.1109/TEST.2007.4437636