Title :
SiP-test: Predicting delivery quality
Author :
Biewenga, Alex ; De Jong, Frans
Author_Institution :
NXP Semicond., Eindhoven
Abstract :
This paper presents the intricacies of predicting delivery quality of system in package (SiP) devices. The basic production process is explained first. The delivery quality of SiPs is discussed in relation to manufacturing yield and test coverage. The presented tools have been kept as simple as possible in order to make quick and easy application possible. Finally a method for sensitivity analysis is presented that helps to fine tune the balance between yield and test coverage in order to be able to optimize the cost versus benefits.
Keywords :
integrated circuit testing; sensitivity analysis; system-in-package; SiP-test; delivery quality prediction; manufacturing yield; sensitivity analysis; system in package devices; test coverage; Assembly; Circuit testing; Cost function; Integrated circuit packaging; Integrated circuit testing; Materials testing; Optimization methods; Production; Pulp manufacturing; Sensitivity analysis;
Conference_Titel :
Test Conference, 2007. ITC 2007. IEEE International
Conference_Location :
Santa Clara, CA
Print_ISBN :
978-1-4244-1127-6
Electronic_ISBN :
1089-3539
DOI :
10.1109/TEST.2007.4437652
