DocumentCode
2853810
Title
SiP-test: Predicting delivery quality
Author
Biewenga, Alex ; De Jong, Frans
Author_Institution
NXP Semicond., Eindhoven
fYear
2007
fDate
21-26 Oct. 2007
Firstpage
1
Lastpage
10
Abstract
This paper presents the intricacies of predicting delivery quality of system in package (SiP) devices. The basic production process is explained first. The delivery quality of SiPs is discussed in relation to manufacturing yield and test coverage. The presented tools have been kept as simple as possible in order to make quick and easy application possible. Finally a method for sensitivity analysis is presented that helps to fine tune the balance between yield and test coverage in order to be able to optimize the cost versus benefits.
Keywords
integrated circuit testing; sensitivity analysis; system-in-package; SiP-test; delivery quality prediction; manufacturing yield; sensitivity analysis; system in package devices; test coverage; Assembly; Circuit testing; Cost function; Integrated circuit packaging; Integrated circuit testing; Materials testing; Optimization methods; Production; Pulp manufacturing; Sensitivity analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 2007. ITC 2007. IEEE International
Conference_Location
Santa Clara, CA
ISSN
1089-3539
Print_ISBN
978-1-4244-1127-6
Electronic_ISBN
1089-3539
Type
conf
DOI
10.1109/TEST.2007.4437652
Filename
4437652
Link To Document