Title :
Electrical analysis of interconnections in a solid state circuit environment
Author_Institution :
IBM T.J. Watson Res. Center, Yorktown Heights, N.Y., USA
Abstract :
A new technique for analyzing the transmission properties of dense integrated circuit interconnections will be discussed. Analytical methods for calculation of appropriate equivalent circuit elements representing conductor geometries will be presented.
Keywords :
Capacitance; Conductors; Distributed parameter circuits; Equivalent circuits; Geometry; Integral equations; Integrated circuit interconnections; Microwave theory and techniques; Packaging; Solid state circuits;
Conference_Titel :
Solid-State Circuits Conference. Digest of Technical Papers. 1972 IEEE International
Conference_Location :
Philadelphia, PA, USA
DOI :
10.1109/ISSCC.1972.1155098
