• DocumentCode
    2854430
  • Title

    Panel synopsis: Where is car IC testing going?

  • Author

    Okuda, Y.

  • Author_Institution
    ITC-Asia Subcommittee, Sony Corp., Atsugi
  • fYear
    2007
  • fDate
    21-26 Oct. 2007
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    Summary form only given. To boost car safety and comfort, car ICs are becoming highly integrated systems, which will shift the car IC business model to models similar SoC, chipsets, and fabless. The panel, composed of car IC experts from US, European, and Japanese companies will debate what is changing for car IC testing and explore potential solutions to current and future challenges.
  • Keywords
    automotive electronics; integrated circuit testing; SoC; automotive electronics; car IC testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 2007. ITC 2007. IEEE International
  • Conference_Location
    Santa Clara, CA
  • ISSN
    1089-3539
  • Print_ISBN
    978-1-4244-1127-6
  • Type

    conf

  • DOI
    10.1109/TEST.2007.4437694
  • Filename
    4437694
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2854430