DocumentCode :
2854430
Title :
Panel synopsis: Where is car IC testing going?
Author :
Okuda, Y.
Author_Institution :
ITC-Asia Subcommittee, Sony Corp., Atsugi
fYear :
2007
fDate :
21-26 Oct. 2007
Firstpage :
1
Lastpage :
1
Abstract :
Summary form only given. To boost car safety and comfort, car ICs are becoming highly integrated systems, which will shift the car IC business model to models similar SoC, chipsets, and fabless. The panel, composed of car IC experts from US, European, and Japanese companies will debate what is changing for car IC testing and explore potential solutions to current and future challenges.
Keywords :
automotive electronics; integrated circuit testing; SoC; automotive electronics; car IC testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Test Conference, 2007. ITC 2007. IEEE International
Conference_Location :
Santa Clara, CA
ISSN :
1089-3539
Print_ISBN :
978-1-4244-1127-6
Type :
conf
DOI :
10.1109/TEST.2007.4437694
Filename :
4437694
Link To Document :
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