• DocumentCode
    2854819
  • Title

    Electrical Property Enhanced Tomography (EPET)

  • Author

    Gregory, William D. ; Gregory, Christopher W.

  • Volume
    4
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    2632
  • Abstract
    We report a simulation study of a method for enhancing conventional imaging modalities (CT or MI) by adding information about electrical properties of the object under test. While related to the existing impedance imaging methods, the technique reported here differs in a number of substantive ways, EPET does not attempt to create the image with the electrical data but rather adds electrical property information to the existing modality and, in fact, requires the data from the other modality to locate the position of internal structures in the object. Also, this method arrays the electrode sensors on a fixed geometric structure outside the object and connects to the object with an electrically conductive bolus. Electrical data are acquired from all sensors simultaneously in an applied voltage rather than an injected current mode. As a result of these and other features of the technique, the image inversion problem is well conditioned and errors propagated from input to output are actually reduced by about two orders of magnitude
  • Keywords
    Green´s function methods; biomedical electrodes; biomedical imaging; electric impedance imaging; finite difference methods; iterative methods; tomography; CT; EPET; MI; applied voltage mode; conventional imaging modalities; electrical properties; electrical property enhanced tomography; electrically conductive bolus; electrode sensors; fixed geometric structure; image inversion problem; impedance imaging methods; internal structures; simulation study; Conductivity; Dielectric constant; Electrodes; Geometry; Impedance; Integral equations; Maxwell equations; Sensor arrays; Testing; Tomography;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 2000. Proceedings of the 22nd Annual International Conference of the IEEE
  • Conference_Location
    Chicago, IL
  • ISSN
    1094-687X
  • Print_ISBN
    0-7803-6465-1
  • Type

    conf

  • DOI
    10.1109/IEMBS.2000.901400
  • Filename
    901400