• DocumentCode
    2854932
  • Title

    The TAD integrated crosspoint array

  • Author

    Anderson, T.

  • Author_Institution
    Wescon, Inc., Downers Grove, IL, USA
  • Volume
    XVI
  • fYear
    1973
  • fDate
    14-16 Feb. 1973
  • Firstpage
    62
  • Lastpage
    63
  • Abstract
    A 5 × 9 telephone crosspoint array with DIP packaging will be described. Cost, control, space, insertion loss, isolation, power consumption and comparative reliability advantages will be assessed.
  • Keywords
    Anodes; Costs; Dielectric losses; Dielectric substrates; Protection; Resistors; Semiconductor diodes; Switches; Switching circuits; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference. Digest of Technical Papers. 1973 IEEE International
  • Conference_Location
    Philadelphia, PA, USA
  • Type

    conf

  • DOI
    10.1109/ISSCC.1973.1155150
  • Filename
    1155150
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2854932