Transcription solder bump technology using the evaporation method

Author

Seyama, Kiyotaka ; Yamamoto, Haruhiko ; Satou, Kazuaki ; Yoshimura, Hideaki ; Ota, Hideki ; Usui, Yasuhiro

Author_Institution

Technol. Dev. Div. II, Fujitsu Ltd., Kanagawa, Japan

fYear

1998

fDate

15-17 Apr 1998

Firstpage

314

Lastpage

318

Abstract

We have developed a new transcription solder bump (TSB) technology using the evaporation method. We use this method in the current production of micro solder area array bump (μSAB) formation with 153 μm pitch and on chips with over 8000 bumps. In this method, transcription bumps are formed on a dummy wafer by evaporation using a metal mask. Temporary chips are made by dicing the dummy wafer with evaporated bumps, and then the bumps on the temporary chips are transcribed to real chips. This technology has a high accuracy in terms of bump height of less than 2 μm, and bumping yield is greater than 99.99999% per bump. Also, we have developed a restoration technique for solder bumps with high yield and low cost

Keywords

integrated circuit packaging; integrated circuit yield; masks; microassembling; multichip modules; soldering; vapour deposition; 153 micron; 2 micron; MCM; bump height; bumping yield; dicing; dummy wafer; evaporation method; metal mask; micro solder area array bump formation; solder bump restoration technique; temporary chip bump transcription; temporary chips; transcription bumps; transcription solder bump technology; Application specific integrated circuits; Costs; Fuses; Manufacturing; Multichip modules; Packaging; Pins; Production; Shape; Workstations;

fLanguage

English

Publisher

ieee

Conference_Titel

Multichip Modules and High Density Packaging, 1998. Proceedings. 1998 International Conference on

Conference_Location

Denver, CO

Print_ISBN

0-7803-4850-8

Type

conf

DOI

10.1109/ICMCM.1998.670800

Filename

670800