Title :
Transcription solder bump technology using the evaporation method
Author :
Seyama, Kiyotaka ; Yamamoto, Haruhiko ; Satou, Kazuaki ; Yoshimura, Hideaki ; Ota, Hideki ; Usui, Yasuhiro
Author_Institution :
Technol. Dev. Div. II, Fujitsu Ltd., Kanagawa, Japan
Abstract :
We have developed a new transcription solder bump (TSB) technology using the evaporation method. We use this method in the current production of micro solder area array bump (μSAB) formation with 153 μm pitch and on chips with over 8000 bumps. In this method, transcription bumps are formed on a dummy wafer by evaporation using a metal mask. Temporary chips are made by dicing the dummy wafer with evaporated bumps, and then the bumps on the temporary chips are transcribed to real chips. This technology has a high accuracy in terms of bump height of less than 2 μm, and bumping yield is greater than 99.99999% per bump. Also, we have developed a restoration technique for solder bumps with high yield and low cost
Keywords :
integrated circuit packaging; integrated circuit yield; masks; microassembling; multichip modules; soldering; vapour deposition; 153 micron; 2 micron; MCM; bump height; bumping yield; dicing; dummy wafer; evaporation method; metal mask; micro solder area array bump formation; solder bump restoration technique; temporary chip bump transcription; temporary chips; transcription bumps; transcription solder bump technology; Application specific integrated circuits; Costs; Fuses; Manufacturing; Multichip modules; Packaging; Pins; Production; Shape; Workstations;
Conference_Titel :
Multichip Modules and High Density Packaging, 1998. Proceedings. 1998 International Conference on
Conference_Location :
Denver, CO
Print_ISBN :
0-7803-4850-8
DOI :
10.1109/ICMCM.1998.670800
