DocumentCode :
2855151
Title :
Total productive maintenance in a semiconductor manufacturing firm: an empirical analysis
Author :
Ng, K.C. ; Goh, G.G.G. ; Eze, U.C.
Author_Institution :
Infineon Technol., Ayer Keroh, Malaysia
fYear :
2011
fDate :
6-9 Dec. 2011
Firstpage :
829
Lastpage :
833
Abstract :
Total productive maintenance is claimed to play a key role in improving maintenance and engineering performance in firms. With the use of TPM, manufacturing organizations would be able to reduce wastage and enhance productivity. This study is conducted in a large semiconductor manufacturing firm in Malaysia and analyses the secondary data obtained from the total fabrication monitoring system using paired samples t-test. The results indicate that all the performance measures indicate significant improvements after TPM implementation which lends support to the claim of the effectiveness of TPM. Hence, manufacturing firms need to seriously weigh the pros and cons of TPM implementation and take the necessary steps needed to effectively deploy TPM to enjoy better machine performance rates for increased productivity levels.
Keywords :
maintenance engineering; productivity; semiconductor industry; statistical analysis; waste reduction; TPM implementation; empirical analysis; manufacturing organization; paired sample t-test; productivity; semiconductor manufacturing firm; total fabrication monitoring system; total productive maintenance; waste reduction; Availability; Maintenance engineering; Manufacturing; Productivity; Semiconductor device measurement; Throughput; Total productive maintenance; comparison analysis; secondary data analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Industrial Engineering and Engineering Management (IEEM), 2011 IEEE International Conference on
Conference_Location :
Singapore
ISSN :
2157-3611
Print_ISBN :
978-1-4577-0740-7
Electronic_ISBN :
2157-3611
Type :
conf
DOI :
10.1109/IEEM.2011.6118032
Filename :
6118032
Link To Document :
بازگشت