• DocumentCode
    2855419
  • Title

    Two-dimensional layout migration by soft constraint satisfaction

  • Author

    Tang, Qianying ; Zhu, Jianwen

  • Author_Institution
    Electr. & Comput. Eng., Toronto Univ., Ont., Canada
  • fYear
    2005
  • fDate
    21-23 March 2005
  • Firstpage
    35
  • Lastpage
    39
  • Abstract
    Layout migration has re-emerged as an important task due to the increasing use of library hard intellectual properties. While recent advances of migration tools have accommodated new metrics, the underlying engine is based on the one-dimensional (1D) layout compaction algorithm, largely due to its efficiency compared to its two-dimensional (2D) counterpart. In this paper, we propose a new method that can overcome the artificial constraints introduced by the 1D compaction algorithm, thereby effectively achieving the quality of 2D compaction yet keeping the computational cost almost as low as 1D compaction. Our method is based on the application of soft constraints, or artificial constraints that are initially relaxed, and gradually tightened to be satisfied. We demonstrate the effectiveness of our approach by successfully solving the difficult 1D compaction instances we found in the migration of the Berkeley low power library, originally developed for 1.2 μm MOSIS process, into TSMC 0.25 μm and 0.18 μm technology.
  • Keywords
    circuit layout CAD; industrial property; software libraries; system-on-chip; 0.18 micron; 0.25 micron; 1D compaction; 2D compaction; Berkeley low power library; SoC; TSMC; artificial constraints; intellectual property; library hard intellectual properties; soft constraint satisfaction; system-on-chip; two-dimensional layout migration; Compaction; Computational efficiency; Costs; Engines; Foundries; Intellectual property; Libraries; Logic; Productivity; Two dimensional displays;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Quality of Electronic Design, 2005. ISQED 2005. Sixth International Symposium on
  • Print_ISBN
    0-7695-2301-3
  • Type

    conf

  • DOI
    10.1109/ISQED.2005.126
  • Filename
    1410554