• DocumentCode
    2855874
  • Title

    A comparison of technology trajectories between the global and the United States in smart grid

  • Author

    Lin, Siou-Zih ; Chen, Ssu-Han ; Wang, Chun-Chieh ; Chen, Dar-Zen

  • Author_Institution
    Grad. Inst. of Ind. Eng., Nat. Taiwan Univ. (NTU), Taipei, Taiwan
  • fYear
    2011
  • fDate
    6-9 Dec. 2011
  • Firstpage
    1028
  • Lastpage
    1032
  • Abstract
    This study aims to compare the technology trajectories between the United States (U.S.) and the global nations in the smart grid field. Highly cited patents were collected from 2001/1/1 to 2010/12/31 and then were analyzed through bibliographic coupling method, sliding TCT-based citation window and Girvan-Newman clustering for being converted into a global technology trajectory map as well as a U.S. one. Firstly, results show that three of the global technology trajectories are time-lagged than its counterparts of the U.S. one, including electronic trading, dynamic power and workload management, and network monitoring through user profiles. Secondly, we found that two of the U.S. technology trajectories does exist but cannot be found in the global map, containing remote monitoring, automatic trading process and interface circuit system. Lastly, the conditional purchase offer management (CPO Management) and also the dynamic policy management (DPM) of the global trajectories are missing in the U.S. map.
  • Keywords
    power system management; smart power grids; CPO management; Girvan-Newman clustering; United States; bibliographic coupling method; conditional purchase offer management; dynamic policy management; electronic trading; remote monitoring; sliding TCT-based citation window; smart grid; technology trajectories; Computers; Couplings; Monitoring; Patents; Smart grids; Trajectory; Wireless LAN; Technology front; patent analysis; smart grid; technology trajectory;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Engineering and Engineering Management (IEEM), 2011 IEEE International Conference on
  • Conference_Location
    Singapore
  • ISSN
    2157-3611
  • Print_ISBN
    978-1-4577-0740-7
  • Electronic_ISBN
    2157-3611
  • Type

    conf

  • DOI
    10.1109/IEEM.2011.6118071
  • Filename
    6118071