DocumentCode
285598
Title
New results and algorithms for MCM substrate testing
Author
Kahng, A.B. ; Robins, G. ; Walkup, E.A.
Author_Institution
Dept. of Comput. Sci., California Univ., Los Angeles, CA, USA
Volume
3
fYear
1992
fDate
10-13 May 1992
Firstpage
1113
Abstract
Substrate testing is critical to cost-effective MCM (multichip module) production. The authors formulate this problem as the verification of a set of trees using k -probes, and present linear-time algorithms for optimal probe generation. The algorithms yield near-optimal probe sets for complete fault coverage. It is shown that the associated probe scheduling problem is metric, and a bounded-error scheduling heuristic is obtained. Furthermore, an insertion-based heuristic is presented which exploits the special structure of 3-pin and the power/ground nets in the MCM substrate. This heuristic significantly improves probing costs over previous methods. Simulations using industry benchmarks show reductions in testing costs of up to 21% over the best previous methods
Keywords
fault location; integrated circuit testing; multichip modules; production testing; scheduling; trees (mathematics); MCM substrate testing; bounded-error scheduling heuristic; complete fault coverage; insertion-based heuristic; linear-time algorithms; multichip module; open fault detection; optimal probe generation; packaging; probe scheduling problem; trees; Circuit faults; Circuit testing; Computer science; Delay; Logic testing; Packaging; Printed circuits; Probes; Routing; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems, 1992. ISCAS '92. Proceedings., 1992 IEEE International Symposium on
Conference_Location
San Diego, CA
Print_ISBN
0-7803-0593-0
Type
conf
DOI
10.1109/ISCAS.1992.230284
Filename
230284
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