Title :
New results and algorithms for MCM substrate testing
Author :
Kahng, A.B. ; Robins, G. ; Walkup, E.A.
Author_Institution :
Dept. of Comput. Sci., California Univ., Los Angeles, CA, USA
Abstract :
Substrate testing is critical to cost-effective MCM (multichip module) production. The authors formulate this problem as the verification of a set of trees using k-probes, and present linear-time algorithms for optimal probe generation. The algorithms yield near-optimal probe sets for complete fault coverage. It is shown that the associated probe scheduling problem is metric, and a bounded-error scheduling heuristic is obtained. Furthermore, an insertion-based heuristic is presented which exploits the special structure of 3-pin and the power/ground nets in the MCM substrate. This heuristic significantly improves probing costs over previous methods. Simulations using industry benchmarks show reductions in testing costs of up to 21% over the best previous methods
Keywords :
fault location; integrated circuit testing; multichip modules; production testing; scheduling; trees (mathematics); MCM substrate testing; bounded-error scheduling heuristic; complete fault coverage; insertion-based heuristic; linear-time algorithms; multichip module; open fault detection; optimal probe generation; packaging; probe scheduling problem; trees; Circuit faults; Circuit testing; Computer science; Delay; Logic testing; Packaging; Printed circuits; Probes; Routing; Wiring;
Conference_Titel :
Circuits and Systems, 1992. ISCAS '92. Proceedings., 1992 IEEE International Symposium on
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-0593-0
DOI :
10.1109/ISCAS.1992.230284