Research of heat dissipation of RGB-LED backlighting system on LCD

Heat dissipation is a very important subject during the design of RGB-LED backlighting system on LCD because the heat produced by modern LEDs themselves can excessively influence their characteristics. This paper reports on a new substrate technology that offers significant benefits over conventional polymer-based insulated metal substrates (IMS). This new type of insulated aluminum substrate printed circuit board (PCB) consists of a thermally-conductive aluminum alloy substrate that insulated by a thin, chemically grown, anodized dielectric layer. Circuit is formed above the anodized layer with magnetron sputtering technology. The corresponding thermal resistances of the new and conventional insulated metal substrate printed circuit board (PCB) are measured to be 4.78degC /W and 7.61degC/W, respectively. More heat transfer means more reliable product, less light reduction and less material consumption because of eliminating the need for additional heat sinks.