DocumentCode :
285600
Title :
An approach to VLSI circuit reliability optimization considering the hot electron effects
Author :
Huang, Min ; Styblinski, M.A.
Author_Institution :
Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
Volume :
3
fYear :
1992
fDate :
10-13 May 1992
Firstpage :
1101
Abstract :
An approach to suppressing the degradation caused by hot electron effects is proposed in which releasing the stress of critical transistors by optimal parametric design is presented, and design-of-experiment techniques are used to improve its efficiency. An application to a VLSI sense amplifier is presented, in which a significant reduction in the hot electron induced delay shift is achieved. For the specific circuit considered, the proposed approach has led to a simpler practical method of VLSI circuit reliability improvement considering hot electron effects, in comparison with the generalized formulation of drift reliability optimization presented by M.A. Styblinski and M. Huang (1991)
Keywords :
VLSI; circuit reliability; hot carriers; integrated circuit technology; VLSI circuit; critical transistors; hot electron effects; induced delay shift; optimal parametric design; reliability optimization; sense amplifier; Circuit synthesis; Degradation; Electrons; Failure analysis; Hot carriers; MOSFETs; Performance evaluation; Stress measurement; Time measurement; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Circuits and Systems, 1992. ISCAS '92. Proceedings., 1992 IEEE International Symposium on
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-0593-0
Type :
conf
DOI :
10.1109/ISCAS.1992.230287
Filename :
230287
Link To Document :
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