DocumentCode :
2856297
Title :
Reduction of conducted EMI for SiC JFET inverters by separating heat sinks
Author :
Gong, Xun ; Ferreira, J.A.
Author_Institution :
Fac. of EWI, Delft Univ. of Technol., Delft, Netherlands
Volume :
2
fYear :
2012
fDate :
2-5 June 2012
Firstpage :
1070
Lastpage :
1077
Abstract :
This paper proposes to use separate heat sinks to reduce the conducted electromagnetic interference (EMI) for a Silicon Carbide (SiC) JFET inverter for motor drives. The inverter circuit layout is implemented with discrete SiC JFETs attached on top of the heat sink, which creates extensive capacitive couplings and moreover increases the parasitic oscillations. To minimize the influence, the solution of using separate heat sinks is proposed. For better CM performance, the high side heat sink is grounded to avoid the fast dv/dts that occur between the drain of the lower switch and the low side heat sink. For better DM performance, the RC snubber circuit and ferrite beads are used to dampen the parasitic oscillations. Two 2.2 kW inverters prototypes - with six discrete SiC JFETs on one common heat sink and separate heat sinks respectively are built using the same circuit layout. Their EMC performance is compared under unfiltered and filtered conditions. The experiments show that the separate heat sinks inverter system exhibits a significantly reduced EMI, however still can not satisfy the imposed standard. Finally, three improved methods are proposed, which effectively suppresses the emitted EMI to comply with the standard of IEC61800-3-C2: Qp.
Keywords :
IEC standards; electromagnetic interference; electromagnetic oscillations; heat sinks; integrated circuit layout; invertors; junction gate field effect transistors; motor drives; silicon compounds; snubbers; wide band gap semiconductors; IEC61800-3-C2: Qp.standard; RC snubber circuit; SiC; SiC JFET inverters; conducted EMI; discrete SiC JFET; electromagnetic interference; extensive capacitive couplings; ferrite beads; inverter circuit layout; inverters prototypes; motor drives; parasitic oscillations; power 2.2 kW; separating heat sinks; silicon carbide; Delta modulation; Heat sinks; Inverters; JFETs; Oscillators; Silicon carbide; Switches; Capacitive coupling; Electromagnetic Interference; Heat sink; Parasitic oscillation; Silicon Carbide;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Electronics and Motion Control Conference (IPEMC), 2012 7th International
Conference_Location :
Harbin
Print_ISBN :
978-1-4577-2085-7
Type :
conf
DOI :
10.1109/IPEMC.2012.6258959
Filename :
6258959
Link To Document :
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