DocumentCode
2856556
Title
Charge-coupled image-sensing devices using three levels of polysilicon
Author
Sequin, C. ; Sealer, D. ; Bertram, W. ; Buckley, Robert ; Morris, F. ; Shankoff, T. ; Tompsett, M.
Author_Institution
Bell Laboratories, Murray Hill, NJ, USA
Volume
XVII
fYear
1974
fDate
15-13 Feb. 1974
Firstpage
24
Lastpage
25
Abstract
Charge-coupled linear and area-image sensors have been built using a three-phase polysilicon approach with overlapping electrodes in three levels of polysilicon. The structure has been found to relax the demands on photolithography and shows extremely good transfer efficiency.
Keywords
Bars; Charge coupled devices; Electrodes; Etching; Fabrication; Frequency; Gettering; Image sensors; Insulation; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Circuits Conference. Digest of Technical Papers. 1974 IEEE International
Conference_Location
Philadelphia, PA, USA
Type
conf
DOI
10.1109/ISSCC.1974.1155259
Filename
1155259
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