DocumentCode :
2856607
Title :
A Simulator for Multi-Core Processor Micro-Architecture Featuring Inter-Core Communication, Power and Thermal Behavior
Author :
Xu, Jun ; Zhu, Yongxin ; Jiang, Lei ; Ni, Junjie ; Zheng, Kai
Author_Institution :
Sch. of Microelectron., Shanghai Jiao Tong Univ., Shanghai
fYear :
2008
fDate :
29-31 July 2008
Firstpage :
237
Lastpage :
242
Abstract :
To effectively evaluate thermal behavior and inter-core communication on multi-core processors, we propose a simulation methodology and the corresponding implementation with runtime power and temperature calculation in this paper. The multi-core simulator is extended from our previous work, i.e. a heteromerous dual-core simulator. In our updated simulator, the well-established power model Wattch and a transient thermal simulation algorithm TILTS are integrated. The simulator is able to provide the runtime power and temperature metrics with little additional overhead compared with the original performance simulator. These results are illustrated with multimedia applications making use of all cores via inter-core communications. As far as we learn, we would like to highlight that our simulator is the first multi-core processor simulator based on SimpleScalar with thermal behavior and inter-core communication enabled. This simulator must be helpful for processor architects to make early decisions on thermal and performance trade-offs.
Keywords :
microprocessor chips; performance evaluation; intercore communication; multicore processor microarchitecture; multicore simulator; temperature calculation; transient thermal simulation algorithm; Analytical models; Conferences; Embedded software; Microelectronics; Multicore processing; Performance loss; Power system modeling; Runtime; Temperature; Testing; inter-core communication; multi-core processor; power; simulator; thermal;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Embedded Software and Systems Symposia, 2008. ICESS Symposia '08. International Conference on
Conference_Location :
Sichuan
Print_ISBN :
978-0-7695-3288-2
Type :
conf
DOI :
10.1109/ICESS.Symposia.2008.86
Filename :
4627164
Link To Document :
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