DocumentCode
2856667
Title
Implications of LSI
Author
Haddad, Jack
Author_Institution
IBM System Product Div., White Plain, NY, USA
Volume
XVII
fYear
1974
fDate
15-13 Feb. 1974
Firstpage
50
Lastpage
51
Abstract
The dramatic increase in density of circuits on silicon chips has important and far-reaching implications for the design process, reliability, power, cost, manufacturing, and nature and functions of end products, based on LSI technologies. Today, 250 microinch (6μm) geometries are common; 150 microinch (4μm) geometries are in current commercial use. In the next ten years, LSI could be based on 25-60 microinch (0.6 - 1.5μm) geometries. Why, Wherein lies the value of such technologies? How will these technologies affect end products, the manner in which the products are designed, manufactured and tested, and the way people will use them?
Keywords
Circuit testing; Cost function; Design automation; Graphics; Investments; Large scale integration; Logic circuits; Logic design; Packaging; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Circuits Conference. Digest of Technical Papers. 1974 IEEE International
Conference_Location
Philadelphia, PA, USA
Type
conf
DOI
10.1109/ISSCC.1974.1155264
Filename
1155264
Link To Document