DocumentCode :
2857204
Title :
Passive hierarchical model order reduction and realization of RLCM circuits
Author :
Liu, Pu ; Qi, Zhenyu ; Tan, Sheldon X D
Author_Institution :
Dept. of Electr. Eng., California Univ., Riverside, CA, USA
fYear :
2005
fDate :
21-23 March 2005
Firstpage :
603
Lastpage :
608
Abstract :
This paper presents a novel compact passive modeling technique for high-performance RF passives and interconnects modeled as high-order RLCM circuits. The new method is based on a recently proposed general s-domain hierarchical modeling and analysis method. In this work, we first apply a state-space based optimization technique to enforce passivity on the hierarchical model order reduced admittance matrix. To realize the passivity-enforced admittance, we propose a general multiport network realization method based on relaxed one-port network synthesis technique based on Foster´s canonical form. The resulting modeling algorithm leads to general SPICE-in and SPICE-out multi-port passive realization of any linear passive networks with easily controlled model accuracy and complexity. The experimental results on a number of PEEC modeled bus line circuits demonstrate the effectiveness of the proposed algorithm.
Keywords :
SPICE; VLSI; electric admittance; integrated circuit design; integrated circuit interconnections; multiport networks; radiofrequency integrated circuits; state-space methods; Foster canonical form; PEEC; SPICE-in multi-port passive realization; SPICE-out multi-port passive realization; bus line circuits; general multiport network realization; general s-domain hierarchical modeling; high-order RLCM circuits; high-performance RF passives; interconnects; model accuracy; passive hierarchical model order reduction; passivity-enforced admittance; reduced admittance matrix; relaxed one-port network synthesis; state-space based optimization; Admittance; Coupling circuits; Inductance; Integrated circuit interconnections; Magnetic analysis; Merging; Mutual coupling; Passive networks; RLC circuits; Solid modeling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Quality of Electronic Design, 2005. ISQED 2005. Sixth International Symposium on
Print_ISBN :
0-7695-2301-3
Type :
conf
DOI :
10.1109/ISQED.2005.92
Filename :
1410651
Link To Document :
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