• DocumentCode
    2857258
  • Title

    Aging mechanisms in strained Si/high-k based pMOS transistors. Implications in CMOS circuits

  • Author

    Martin-Martinez, J. ; Amat, E. ; Ayala, N. ; Gonzalez, M.B. ; Verheyen, P. ; Rodriguez, R. ; Nafria, M. ; Aymerich, X. ; Simoen, E.

  • Author_Institution
    Dept. Eng. Electron., Univ. Autonoma de Barcelona, Bellaterra, Spain
  • fYear
    2011
  • fDate
    8-11 Feb. 2011
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Channel Hot Carrier (CHC) and Negative Bias Temperature Instability (NBTI) degradation has been studied in pMOSFETs with and without channel strain. The results show larger CHC degradation and a neglegible influence of NBTI on strained pMOS devices. The degradation effects are modeled to be introduced in a circuit simulator. The simulations of a CMOS inverter, which has been chosen as example circuit, show that degradation shifts the Voltage Transfer Characteristic (VTC). This effect is higher in strained devices. Concerning to the circuit speed and power consumption, the best initial performance of circuits designed with strained devices compensates their larger degradation.
  • Keywords
    CMOS integrated circuits; MOSFET; ageing; elemental semiconductors; high-k dielectric thin films; hot carriers; invertors; semiconductor device models; silicon; CHC degradation; CMOS circuits; CMOS inverter simulations; NBTI degradation; Si; aging mechanisms; channel hot carrier; channel strain; circuit simulator; negative bias temperature instability degradation; pMOSFET; power consumption; strained Si-high-k based pMOS transistors; voltage transfer characteristic; Degradation; Integrated circuit modeling; Inverters; MOSFETs; Silicon germanium; Stress; CMOS circuits; Channel Hot Carriers; Negative Bias Temperature Instability; Reliability; Silicon strain;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices (CDE), 2011 Spanish Conference on
  • Conference_Location
    Palma de Mallorca
  • Print_ISBN
    978-1-4244-7863-7
  • Type

    conf

  • DOI
    10.1109/SCED.2011.5744167
  • Filename
    5744167