Title :
Defect level prediction of printed circuit board assembly manufacturing based on DPMO metric
Author_Institution :
Dept. of Technol. & Meas., Univ. of West Bohemia, Pilsen, Czech Republic
Abstract :
Companies in the electronics industry need to plan production test strategy for new products in early design phase even before any designs are actually finalized. This paper presents a defect level prediction tool based on Defects per Million Opportunities (DPMO) metric, which is intended for newly designed printed circuit board assemblies (PCBAs), especially ones determined for automotive industry. Due to this tool is possible to analyze and assess test strategy alternatives by using the estimated defects.
Keywords :
assembling; printed circuit design; printed circuit manufacture; printed circuit testing; product design; production planning; production testing; DPMO metric; defect level prediction; defects per million opportunities; electronics industry; printed circuit board assembly manufacturing; product design phase; production test strategy planning; Conferences; Electron devices; DPMO; Printed circuit board; defect level prediction;
Conference_Titel :
Electron Devices (CDE), 2011 Spanish Conference on
Conference_Location :
Palma de Mallorca
Print_ISBN :
978-1-4244-7863-7
DOI :
10.1109/SCED.2011.5744196
