Void free die attachment for multichip modules using solder alloys

The increasing demand and advancement of integrated circuits has placed an important focus on electronic packaging, materials and processing. Any variations have an effect on temperature uniformity, reliability and integrity of the multichip modules. The presence of voids reduces the reliability of the device when subjected to mechanical and thermal stresses. Improved advancements were developed where fluxless and voidless results were achieved using a technique referred to as the “pressure variation” method. The principle of the pressure variation method is to use external gas pressure to compress the air trapped in the joint