• DocumentCode
    2857884
  • Title

    On-line characterization and reconfiguration for single event upset variations

  • Author

    Zick, Kenneth M. ; Hayes, John P.

  • Author_Institution
    Adv. Comput. Archit. Lab., Univ. of Michigan, Ann Arbor, MI, USA
  • fYear
    2009
  • fDate
    24-26 June 2009
  • Firstpage
    243
  • Lastpage
    248
  • Abstract
    The amount of physical variation among electronic components on a die is increasing rapidly. There is a need for a better understanding of variations in transient fault susceptibility, and for methods of on-line adaptation to such variations. We address three key research questions in this area. First, we investigate accelerated characterization of individual latch susceptibilities. We find that on the order of 10 upsets per latch must be observed for variations to be adequately characterized. Second, we propose a method of on-line hardware reconfiguration using incremental place-and-route on FPGAs. Surprisingly, we find that highly localized place-and-route changes (e.g. restricted to groups of 8 flip-flops) are sufficient for realizing most of the possible benefits. Lastly, we quantify potential improvements in system-level soft error rates via Monte Carlo simulation experiments. The study highlights both what is required for and what can be gained by on-line adaptation.
  • Keywords
    Monte Carlo methods; circuit reliability; field programmable gate arrays; flip-flops; FPGAs; Monte Carlo simulation; die; flip-flops; incremental place-and-route; latch susceptibility; localized place-and-route changes; on-line hardware reconfiguration; single event upset variation reconfiguration; system-level soft error rates; transient fault susceptibility; Computer architecture; Error analysis; Field programmable gate arrays; Flip-flops; Hardware; Laboratories; Latches; Single event transient; Single event upset; Threshold voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    On-Line Testing Symposium, 2009. IOLTS 2009. 15th IEEE International
  • Conference_Location
    Sesimbra, Lisbon
  • Print_ISBN
    978-1-4244-4596-7
  • Electronic_ISBN
    978-1-4244-4595-0
  • Type

    conf

  • DOI
    10.1109/IOLTS.2009.5196023
  • Filename
    5196023