Title :
Integrated passive devices using Al/BCB thin films
Author :
Clearfield, H.M. ; Wijeyesekera, S. ; Logan, E.A. ; Luu, A. ; Gieser, D. ; Lin, C.-M. ; Jing, J. ; Rogers, W.B. ; Scheck, D. ; Benson, D. ; He, J.
Author_Institution :
Intarsia Corp., Fremont, CA, USA
Abstract :
A new structure for thin film integrated passive devices using aluminum interconnection and photo-BCB dielectrics is introduced. The structure is capable of providing a range of capacitance values spanning four orders of magnitude, making it suitable for both digital and high frequency applications. The thin films are built on glass substrates in a 350×400 mm format to take advantage of the economy of scale that comes from such a format. The structure is described and preliminary characterization and reliability test results are summarized
Keywords :
aluminium; dielectric thin films; digital circuits; electron device testing; inductors; microwave circuits; packaging; polymer films; reliability; thin film capacitors; thin film devices; thin film resistors; 350 mm; 400 mm; Al; Al/BCB thin films; aluminum interconnection; capacitance; digital applications; glass substrates; high frequency applications; integrated passive devices; photo-BCB dielectrics; reliability test; thin film integrated passive devices; Aluminum; Capacitance; Dielectric devices; Dielectric substrates; Dielectric thin films; Economies of scale; Frequency; Glass; Testing; Thin film devices;
Conference_Titel :
Multichip Modules and High Density Packaging, 1998. Proceedings. 1998 International Conference on
Conference_Location :
Denver, CO
Print_ISBN :
0-7803-4850-8
DOI :
10.1109/ICMCM.1998.670831
