Title :
A multichip page size image sensor
Author :
Perregaux, Alain
Author_Institution :
Xerox Corp., Webster, NY, USA
Abstract :
With the advent of digital copiers, there is an increasing need for scanners that can operate at high speed, at a reasonable price, without any loss of image quality. With this application in mind, Xerox has developed a page size image sensor. This device is an in-line multichip module that measures approximately 325×30 mm. It is made of 20 independent VLSI sensor chips mounted end to end on a special printed wiring board substrate. The substrate, the die bonding, and the wire bonding make use of well known materials and techniques. The size of the device, the chip dicing accuracy, and the assembly accuracy are the features that make this device unique. As the sensor length matches the page size, the collection of light is efficient and uniform. Even at scanning speeds of 100 pages per minute or higher, the image quality is exceptional
Keywords :
VLSI; image scanners; image sensors; integrated circuit packaging; lead bonding; multichip modules; photocopying; 30 mm; 325 mm; VLSI sensor chips; assembly accuracy; chip dicing accuracy; device size; die bonding; digital copiers; image quality; in-line multichip module; light collection; multichip page size image sensor; page size; page size image sensor; printed wiring board substrate; scanner operating speed; scanners; scanning speed; sensor length; wire bonding; Assembly; Bonding; Image quality; Image sensors; Microassembly; Multichip modules; Semiconductor device measurement; Very large scale integration; Wire; Wiring;
Conference_Titel :
Multichip Modules and High Density Packaging, 1998. Proceedings. 1998 International Conference on
Conference_Location :
Denver, CO
Print_ISBN :
0-7803-4850-8
DOI :
10.1109/ICMCM.1998.670834