Flip chip MPU module on high performance printed circuit board “ALIVH”

Author

Shiraishi, Tsukasa ; Amami, Kazuyoshi ; Bessho, Yoshiríro ; Sakamaoto, Kazunori ; Eda, Kazuo ; Ishida, Toru ; Fukuoka, Kazuyoshi

Author_Institution

Matsushita Electr. Ind. Co. Ltd., Kadoma, Japan

fYear

1998

fDate

15-17 Apr 1998

Firstpage

520

Lastpage

525

Abstract

This paper describes of a flip chip MPU module on a high performance “ALIVH^TM (any layer inner via hole)” printed circuit board structure for sub-note PCs using a modified SBB ^TM (stud bump bonding) technique. The SBB technique is an advanced flip-chip bonding technique for high density multichip modules (MCMs), which can mount bare LSI chips directly on substrates. The structure of the bonding portion is composed of Au bumps with two-stepped construction and conductive adhesives. The ALIVH substrate is a high density and high performance multilayered printed wiring board with any layer inner via hole structure, via hole processing technology using a CO₂ laser and interconnection technology that employs conductive paste. In this fabricated MPU module, 4 LSI chips are mounted on an 8-layer ALIVH substrate and the clock frequency is 160 MHz. The weight of the module was reduced to 40% of that of the conventional module

Keywords

adhesion; conducting polymers; flip-chip devices; integrated circuit interconnections; integrated circuit packaging; laser beam machining; laser materials processing; microassembling; microprocessor chips; multichip modules; notebook computers; 160 MHz; ALIVH printed circuit board; ALIVH substrate; Au; CO₂; CO₂ laser processing; LSI chips; MCMs; MPU module; any layer inner via hole PCB structure; any layer inner via hole structure; bare LSI chip direct mounting; bonding portion structure; clock frequency; conductive adhesives; conductive paste; flip chip MPU module; flip-chip bonding technique; high density multichip modules; interconnection technology; modified SBB technique; modified stud bump bonding technique; module weight; multilayered printed wiring board; printed circuit board structure; sub-note PCs; two-stepped Au bumps; via hole processing technology; Bonding; Conductive adhesives; Flip chip; Gold; Integrated circuit interconnections; Large scale integration; Multichip modules; Personal communication networks; Printed circuits; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Multichip Modules and High Density Packaging, 1998. Proceedings. 1998 International Conference on

Conference_Location

Denver, CO

Print_ISBN

0-7803-4850-8

Type

conf

DOI

10.1109/ICMCM.1998.670835

Filename

670835