مرکز منطقه ای اطلاع رساني علوم و فناوري

DocumentCode :

2858549

Title :

Index of authors

fYear :

1998

fDate :

17-17 April 1998

Firstpage :

546

Lastpage :

547

Abstract :

Presents an index of the authors whose papers are published in the conference.

fLanguage :

English

Publisher :

ieee

Conference_Titel :

Multichip Modules and High Density Packaging, 1998. Proceedings. 1998 International Conference on

Conference_Location :

Denver, CO, USA

Print_ISBN :

0-7803-4850-8

Type :

conf

DOI :

10.1109/ICMCM.1998.670840

Filename :

670840

Link To Document :