DocumentCode
285855
Title
Thermal modelling of solder joint formation
Author
Beckett, P.M. ; Polijanczuk, A.V. ; Whitehead, D.G.
Author_Institution
Dept. of Appl. Math., Hull Univ., Hull, UK
fYear
1993
fDate
34004
Firstpage
42461
Lastpage
42464
Abstract
The use of low-power lasers as an energy source for the purposes of soldering has many advantages. With limited laser power, the creation of a successful solder joint is strongly dependent on controlling and identifying any heat losses. The combination of experimental and theoretical work has identified the importance of: (1) substrate properties: in particular, changing the thermal conductivity can lead to substantial differences in the melting characteristics; (2) the layout of copper tracking: the enhanced sink effect can be very deleterious; and (3) accurate modelling of heat losses to the environment in any theoretical analysis
Keywords
heat losses; heat sinks; laser beam applications; melting; soldering; thermal analysis; thermal conductivity of solids; Cu tracking layout; heat losses; low-power lasers; melting characteristics; sink effect; solder joint formation; substrate properties; thermal conductivity; thermal modelling;
fLanguage
English
Publisher
iet
Conference_Titel
CAD (Computer Aided Design) Tools for Thermal Management, IEE Colloquium on (Digest No.027)
Conference_Location
London
Type
conf
Filename
230762
Link To Document