Title :
IEE Colloquium on `CAD (Computer Aided Design) Tools for Thermal Management´ (Digest No.027)
Abstract :
The development of fast thermal analysis tools for CAD and further practical applications; simulating the behaviour of ceramics during firing; a process model of the IR reflow soldering of printed circuit assemblies; thermal modelling of solder joint formation; application of the FLOTHERM thermal analysis software to telecommunications equipment; CAD techniques for the thermal management of heat transfer in windings; the application of computation fluid dynamics software to solving air flow and heat transfer problems in power supplies; modern materials technologies in PCB thermal management; and a thermal case study of a multichip module
Keywords :
CAD; electrical engineering computing; heat transfer; thermal analysis; CAD tools; FLOTHERM; IR reflow soldering; air flow; ceramics; computation fluid dynamics; computer aided design; firing; heat transfer; materials technologies; multichip module; power supplies; printed circuit assemblies; printed circuit boards; process model; solder joint formation; telecommunications equipment; thermal analysis; thermal management; windings;
Conference_Titel :
CAD (Computer Aided Design) Tools for Thermal Management, IEE Colloquium on (Digest No.027)
Conference_Location :
London
