• DocumentCode
    2859859
  • Title

    The role of piezocomposites in ultrasonic transducers

  • Author

    Smith, Wallace Arden

  • Author_Institution
    Office of US Naval Res., Arlington, VA, USA
  • fYear
    1989
  • fDate
    3-6 Oct 1989
  • Firstpage
    755
  • Abstract
    Combining a piezoelectric ceramic and a passive polymer to form a piezocomposite allows the transducer engineer to design new piezoelectrics that offer substantial advantages over the conventional piezoelectric ceramics and polymers. The rod composite geometry provides materials with enhanced electromechanical coupling and with acoustic impedance close to that of tissue; these factors yield transducers for medical ultrasonic imaging with high sensitivity and compact impulse response. The dice-and-fill technique produces piezocomposites that can be readily formed into complex shapes to facilitate focusing the ultrasonic beam. Proper design of the rod spacing yields materials that exhibit low crosstalk between array elements formed by patterning the electrode alone, without cutting between the elements. In this way, curved annular arrays have been made that provide high-quality clinical images of substantial diagnostic value to physicians. Included is an extensive bibliography of papers documenting the role of piezocomposites in ultrasonic imaging transducers
  • Keywords
    piezoelectric transducers; ultrasonic transducers; array elements; compact impulse response; crosstalk; dice-and-fill technique; electromechanical coupling; high-quality clinical images; medical ultrasonic imaging; passive polymer; piezocomposite; piezoelectric ceramic; rod composite geometry; ultrasonic beam; ultrasonic imaging transducers; Acoustic transducers; Acoustical engineering; Biological materials; Biomedical engineering; Biomedical transducers; Ceramics; Piezoelectric transducers; Polymers; Ultrasonic imaging; Ultrasonic transducers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 1989. Proceedings., IEEE 1989
  • Conference_Location
    Montreal, Que.
  • Type

    conf

  • DOI
    10.1109/ULTSYM.1989.67088
  • Filename
    67088