Title :
IEE Colloquium on `Thermal Management in Power Electronics Systems´ (Digest No.065)
Abstract :
The following topics were dealt with: power electronics; thermal management; heat sinks; cooling; packaging; heat losses; heat dissipation; reliability; electrical contacts; semiconductor device models; digital simulation; semiconductor device testing; thermal design; thermal analysis; railways; and electric traction
Keywords :
cooling; digital simulation; electrical contacts; heat losses; heat sinks; packaging; power convertors; power electronics; railways; reliability; semiconductor device models; semiconductor device testing; thermal analysis; thyristor applications; traction; SDT; cooling; digital simulation; electrical contacts; heat dissipation; heat losses; heat sinks; packaging; power convertors; power electronics; railways; reliability; semiconductor device models; semiconductor device testing; thermal analysis; thermal design; thermal management; thyristor applications; traction;
Conference_Titel :
Thermal Management in Power Electronics Systems, IEE Colloquium on
Conference_Location :
London
