Crosstalk analysis of carbon nanotube bundle interconnects

Author

Zhang, Kailiang ; Tian, Bo ; Zhu, Xiaosong ; Wang, Fang ; Wei, Jun

Author_Institution

Sch. of Electron. Inf. Eng., Tianjin Univ. of Technol., Tianjin, China

fYear

2011

fDate

21-24 June 2011

Firstpage

1

Lastpage

2

Abstract

In this paper, the interconnect parameters for a carbon nanotube (CNT) bundle are calculated first, then the equivalent circuit has been developed to perform the crosstalk analysis and in the end the main influencing factors are discussed. On the basis of simulation which is completed by simulation software SPICE, crosstalk voltage can be decreased by increasing spacing between adjacent lines, setting the appropriate position when the length is fixed, decreasing line length and selecting the appropriate frequency.

Keywords

carbon nanotubes; crosstalk; equivalent circuits; integrated circuit design; integrated circuit interconnections; C; CNT bundle interconnect parameter; SPICE software simulation; adjacent lines; carbon nanotube bundle interconnect parameter; crosstalk analysis; crosstalk voltage; equivalent circuit; Capacitance; Carbon nanotubes; Crosstalk; Integrated circuit interconnections; Integrated circuit modeling; SPICE; Wires; SPICE; carbon nanotube (CNT); crosstalk; interconnects; nanotechnology;

fLanguage

English

Publisher

ieee

Conference_Titel

Nanoelectronics Conference (INEC), 2011 IEEE 4th International

Conference_Location

Tao-Yuan

ISSN

2159-3523

Print_ISBN

978-1-4577-0379-9

Electronic_ISBN

2159-3523

Type

conf

DOI

10.1109/INEC.2011.5991635

Filename

5991635