Title :
Lasers in electronics manufacturing-an industrial view
Author_Institution :
Inernational Computers Ltd., Stoke-on-Trent, UK
Abstract :
The author compares and contrasts two laser technologies: a YAG based network system for removing and replacing soldered electronic devices and an excimer based plastics machining system. Three applications are identified: inner layers with through via holes; surface vias contained within surface mount bands; and, multichip modules with blind vias
Keywords :
electronics industry; integrated circuit manufacture; laser beam machining; multichip modules; printed circuit manufacture; PCB manufacture; YAG based network system; YAl5O12; blind vias; electronics manufacturing; excimer based plastics machining system; inner layers; laser beam machining; laser technologies; multichip modules; soldered electronic devices; surface mount bands; surface vias; through via holes;
Conference_Titel :
Laser Applications, IEE Colloquium on
Conference_Location :
London
