A micromachined diaphragm structure for integrated ultrasound transducers

Author

Mo, J.-H. ; Robinson, A.L. ; Fitting, D.W. ; Terry, F.L., Jr. ; Carson, P.L.

Author_Institution

Solid State Electron. Lab., Michigan Univ., Ann Arbor, MI, USA

fYear

1989

fDate

3-6 Oct 1989

Firstpage

801

Abstract

A diaphragm structure for integrated ultrasound transducers based on micromachining of Si is presented. This device significantly reduces a large parasitic capacitance compared to a nonmicromachined structure, improving transducer sensitivity and minimum detectable signal. It also reduces acoustical crosstalk between transducer elements. Micromachined transducer elements are also shown to be less directive in an array, an indication of crosstalk reduction

Keywords

ultrasonic transducers; Si micromachining; acoustical crosstalk; diaphragm structure; integrated ultrasound transducers; minimum detectable signal; parasitic capacitance; transducer sensitivity; Acoustic propagation; Acoustic transducers; Crosstalk; Dielectric substrates; Electrodes; Fabrication; Parasitic capacitance; Silicon; Ultrasonic imaging; Ultrasonic transducers;

fLanguage

English

Publisher

ieee

Conference_Titel

Ultrasonics Symposium, 1989. Proceedings., IEEE 1989

Conference_Location

Montreal, Que.

Type

conf

DOI

10.1109/ULTSYM.1989.67097

Filename

67097

Link To Document

https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2861334