DocumentCode
2862014
Title
A novel retention-enhanced structure and a reset transient model for energy-efficient electrochemical conducting bridge resistive memory
Author
Lin, Yu-Yu ; Lee, Feng-Ming ; Chien, Wei-Chih ; Chen, Yi-Chou ; Lee, Ming-Hsiu ; Lung, Hsiang-Lan ; Hsieh, Kuang-Yeu ; Lu, Chih-Yuan
Author_Institution
Emerging Central Lab., Macronix Int. Co., Ltd., Hsinchu, Taiwan
fYear
2011
fDate
21-24 June 2011
Firstpage
1
Lastpage
2
Abstract
A novel electrochemical conducting bridge structure with an ion buffer layer and a model of the reset transient behavior are proposed. The addition of the ion-buffer layer to the device retards the Cu-atom diffusing toward the Cu-ion supply layer, thus greatly increases the stability and produces excellent electrical properties. An analytical model is proposed to help understand the entire reset process. Three different types of current are investigated during the reset process: (i) ionic current (ii) tunneling current, and (iii) Ohmic current. Results from simulation and experiments show that the tunneling and the Ohmic currents consume most of the RESET power. To improve the operation efficiency and reduce the RESET current, a new device structure with a high work function tunneling layer is proposed to suppress the tunneling current.
Keywords
bridge circuits; buffer layers; copper; electric properties; ohmic contacts; random-access storage; work function; Cu; Cu-atom diffusing; Cu-ion supply layer; electrical properties; electrochemical conducting bridge resistive memory; electrochemical conducting bridge structure; ion buffer layer; ionic current; ohmic current; reset process; reset transient; retention-enhanced structure; tunneling current; work function tunneling layer; Bridge circuits; Buffer layers; Copper; Current measurement; Resistance; Transient analysis; Tunneling;
fLanguage
English
Publisher
ieee
Conference_Titel
Nanoelectronics Conference (INEC), 2011 IEEE 4th International
Conference_Location
Tao-Yuan
ISSN
2159-3523
Print_ISBN
978-1-4577-0379-9
Electronic_ISBN
2159-3523
Type
conf
DOI
10.1109/INEC.2011.5991707
Filename
5991707
Link To Document