• DocumentCode
    2862014
  • Title

    A novel retention-enhanced structure and a reset transient model for energy-efficient electrochemical conducting bridge resistive memory

  • Author

    Lin, Yu-Yu ; Lee, Feng-Ming ; Chien, Wei-Chih ; Chen, Yi-Chou ; Lee, Ming-Hsiu ; Lung, Hsiang-Lan ; Hsieh, Kuang-Yeu ; Lu, Chih-Yuan

  • Author_Institution
    Emerging Central Lab., Macronix Int. Co., Ltd., Hsinchu, Taiwan
  • fYear
    2011
  • fDate
    21-24 June 2011
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    A novel electrochemical conducting bridge structure with an ion buffer layer and a model of the reset transient behavior are proposed. The addition of the ion-buffer layer to the device retards the Cu-atom diffusing toward the Cu-ion supply layer, thus greatly increases the stability and produces excellent electrical properties. An analytical model is proposed to help understand the entire reset process. Three different types of current are investigated during the reset process: (i) ionic current (ii) tunneling current, and (iii) Ohmic current. Results from simulation and experiments show that the tunneling and the Ohmic currents consume most of the RESET power. To improve the operation efficiency and reduce the RESET current, a new device structure with a high work function tunneling layer is proposed to suppress the tunneling current.
  • Keywords
    bridge circuits; buffer layers; copper; electric properties; ohmic contacts; random-access storage; work function; Cu; Cu-atom diffusing; Cu-ion supply layer; electrical properties; electrochemical conducting bridge resistive memory; electrochemical conducting bridge structure; ion buffer layer; ionic current; ohmic current; reset process; reset transient; retention-enhanced structure; tunneling current; work function tunneling layer; Bridge circuits; Buffer layers; Copper; Current measurement; Resistance; Transient analysis; Tunneling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nanoelectronics Conference (INEC), 2011 IEEE 4th International
  • Conference_Location
    Tao-Yuan
  • ISSN
    2159-3523
  • Print_ISBN
    978-1-4577-0379-9
  • Electronic_ISBN
    2159-3523
  • Type

    conf

  • DOI
    10.1109/INEC.2011.5991707
  • Filename
    5991707