DocumentCode :
2862014
Title :
A novel retention-enhanced structure and a reset transient model for energy-efficient electrochemical conducting bridge resistive memory
Author :
Lin, Yu-Yu ; Lee, Feng-Ming ; Chien, Wei-Chih ; Chen, Yi-Chou ; Lee, Ming-Hsiu ; Lung, Hsiang-Lan ; Hsieh, Kuang-Yeu ; Lu, Chih-Yuan
Author_Institution :
Emerging Central Lab., Macronix Int. Co., Ltd., Hsinchu, Taiwan
fYear :
2011
fDate :
21-24 June 2011
Firstpage :
1
Lastpage :
2
Abstract :
A novel electrochemical conducting bridge structure with an ion buffer layer and a model of the reset transient behavior are proposed. The addition of the ion-buffer layer to the device retards the Cu-atom diffusing toward the Cu-ion supply layer, thus greatly increases the stability and produces excellent electrical properties. An analytical model is proposed to help understand the entire reset process. Three different types of current are investigated during the reset process: (i) ionic current (ii) tunneling current, and (iii) Ohmic current. Results from simulation and experiments show that the tunneling and the Ohmic currents consume most of the RESET power. To improve the operation efficiency and reduce the RESET current, a new device structure with a high work function tunneling layer is proposed to suppress the tunneling current.
Keywords :
bridge circuits; buffer layers; copper; electric properties; ohmic contacts; random-access storage; work function; Cu; Cu-atom diffusing; Cu-ion supply layer; electrical properties; electrochemical conducting bridge resistive memory; electrochemical conducting bridge structure; ion buffer layer; ionic current; ohmic current; reset process; reset transient; retention-enhanced structure; tunneling current; work function tunneling layer; Bridge circuits; Buffer layers; Copper; Current measurement; Resistance; Transient analysis; Tunneling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nanoelectronics Conference (INEC), 2011 IEEE 4th International
Conference_Location :
Tao-Yuan
ISSN :
2159-3523
Print_ISBN :
978-1-4577-0379-9
Electronic_ISBN :
2159-3523
Type :
conf
DOI :
10.1109/INEC.2011.5991707
Filename :
5991707
Link To Document :
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