Design, fabrication and actuation of thermal actuating XY stage

This work presents a thermal actuating XY-stage by using MEMS-based (micro-electro-mechanical system) technologies. The proposed stage is designed as a decoupling XY stage has dimensions of 8.8 × 8.8 × 0.2 mm³ and contains a two-axis decoupling XY stage and has sufficient strength to suspend an image sensor used for anti-shaking function. The processes used to fabricate the stabilizer include Silicon on Isolator (SOI) process, inductively coupled plasma (ICP) processes and HF vapor process. The maximum actuating distance of the stage is larger than 25μm which is sufficient to resolve the shaking problem. Accordingly, the applied voltage for the 25μm moving distance is lower than 20volts. Moreover, the dynamic resonant frequency of the actuating device is 3.5 kHz.