• DocumentCode
    286358
  • Title

    Simulation of coupled electromagnetic and heat dissipation problems

  • Author

    Janssen, H.H.J.M. ; Maten, E. J W ter ; van Houwelingen, D.

  • Author_Institution
    Philips Electronics NV, Res. Labs., Eindhoven, Netherlands
  • fYear
    1993
  • fDate
    34107
  • Firstpage
    42430
  • Lastpage
    42432
  • Abstract
    A description is given of an integrated simulation environment for the solution of problems in two dimensions, in particular for induction heating, dielectric heating, and hysteresis heating. The equations are coupled because most of the material properties are temperature-dependent in a non-linear way. Heating by induction and hysteresis can be modelled separately or as combined processes. All heating problems under consideration may involve thermal convection and radiation at boundaries. Additional temperature dependent heat sources (e.g. resistor heating), and instantaneous effects of movement in the plane on the temperature transfer can be included. General symmetry assumptions can be used as well as special current conservation properties for eddy currents. In this way proximity effects can be studied. Effects around Curie temperature transitions can be analyzed. The software package has been constructed with the high level language PDL (Package Designer Language), using the general `Mammy´ design environment. This concept also involves an easy interface to existing pre- and postprocessing packages and to libraries of numerical subroutines
  • Keywords
    Curie temperature; convection; dielectric heating; digital simulation; eddy currents; heat radiation; induction heating; magnetic hysteresis; software packages; Curie temperature transitions; Package Designer Language; coupled electromagnetic and heat dissipation problems; current conservation; dielectric heating; eddy currents; hysteresis heating; induction heating; integrated simulation environment; proximity effects; radiation at boundaries; software package; temperature transfer; thermal convection;
  • fLanguage
    English
  • Publisher
    iet
  • Conference_Titel
    Coupling Electromagnetic to Other Fields, IEE Colloquium on
  • Conference_Location
    London
  • Type

    conf

  • Filename
    243268