Folded U-shaped micro-wire technology for GaAs IC interconnections

Author

Hirano, M. ; Toyoda, I. ; Tokumitsu, M. ; Asai, K.

Author_Institution

NTT LSI Lab., Kanagawa, Japan

fYear

1997

fDate

4-7 Oct. 1997

Firstpage

177

Lastpage

180

Abstract

A novel microwire structure with folded U-shape cross section has been developed for application in GaAs IC interconnections. The structure enhances the mechanical strength and makes it possible to form an air-bridge with a 3-mm-long reach. Evaluations of the high-frequency characteristics of the wire in a transmission line reveal that this technology can be applied in microwave circuits. This technology makes it possible to transmit a microwave efficiently with a miniaturized coplanar type transmission line. This technology should prove very attractive for developing high-speed GaAs LSIs and compact monolithic microwave integrated circuits.<>

Keywords

III-V semiconductors; MMIC; gallium arsenide; integrated circuit technology; large scale integration; packaging; GaAs integrated circuit interconnections; compact monolithic microwave integrated circuits; folded U-shaped microwire technology; high-frequency characteristics; mechanical strength; microwave circuits; miniaturised coplanar transmission line; semiconductors; Application specific integrated circuits; Coplanar transmission lines; Distributed parameter circuits; Gallium arsenide; Integrated circuit interconnections; Integrated circuit technology; Microwave circuits; Microwave integrated circuits; Microwave technology; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Gallium Arsenide Integrated Circuit (GaAs IC) Symposium, 1992. Technical Digest 1992., 14th Annual IEEE

Conference_Location

Miami Beach, FL, USA

Print_ISBN

0-7803-0773-9

Type

conf

DOI

10.1109/GAAS.1992.247196

Filename

247196