A Fast Algorithm for Segmenting Defects on the Surface of QFN Packages

There are many different types of surface defects on semiconductor integrated chips (IC´s) caused by various factors during manufacturing process, such as scratch, flash, resin bleed, melting and void. These defects must be detected and classified by an inspection system for productivity improvement and effective process control. Among these defects, in particular, resin bleed and melting are the most difficult ones to classify accurately. The shape of resin bleed and melting defects are so similar that normally it is difficult to classify the resin bleed and melting. In this paper, we propose a new segmenting method and a set of features for detecting and classifying the resin bleed and melting defects.