Title :
Packaging for high performance computers
Author_Institution :
IBM Corp., Hopwell Junction, NY, USA
Abstract :
The session will be focused on how packaging technology influences the performance and cost of current and future computers. Alternative packaging designs will be compared, with emphasis on their capabilities, limitations and extendability to future machines.
Keywords :
Computer aided instruction; Cooling; Costs; Coupling circuits; High performance computing; Integrated circuit interconnections; Integrated circuit packaging; Integrated circuit technology; Packaging machines; Propagation delay;
Conference_Titel :
Solid-State Circuits Conference. Digest of Technical Papers. 1978 IEEE International
Conference_Location :
San Francisco, CA, USA
DOI :
10.1109/ISSCC.1978.1155807
