Title :
Design and Fabrication of a Micro Electromagnetic Relay
Author :
Liu, Bendong ; Li, Desheng
Author_Institution :
Coll. of Mech. Eng. & Appl. Electron. Technol., Beijing Univ. of Technol.
Abstract :
A new optimization structure for micro electromagnetic relay is introduced based on the research done before. Three-dimensional structure and new fabrication process is adopted accordingly in the improved design. The new structure can decrease the leak of magnetic circuit and increase the magnetic force. An optimization armature is introduced in order to improve the electromagnetic attract force and decrease the rigidity of the armature. A micro electromagnetic relay is fabricated based on the MEMS technology. The size of the micro electromagnetic relay is about 5 mm times 5 mm times 0.4 mm. The micro relay consists a lower magnetic circuit, a planar exciting coil and a permalloy cantilever. Anisotropic etching, electroplating, polyimide film patterning is adopted in the fabrication process. The exciting coil of the micro electromagnetic relay has 16 turns and the resistance of the coil is about 20 Omega. The initial experiments show that the permalloy cantilever displacement can reach 20 mum at a current and voltage of 250 mA and 5 V
Keywords :
Permalloy; cantilevers; coils; electromagnetic devices; electromagnetic forces; electroplating; etching; microrelays; 20 ohm; 250 mA; 5 V; MEMS technology; anisotropic etching; electromagnetic attract force; electroplating; fabrication process; micro electromagnetic relay; optimization armature; permalloy cantilever; planar exciting coil; polyimide film patterning; Anisotropic magnetoresistance; Coils; Electromagnetic forces; Etching; Fabrication; Magnetic circuits; Magnetic forces; Micromechanical devices; Microrelays; Relays; MEMS; electromagnetic actuator; micro relay;
Conference_Titel :
Mechatronics and Automation, Proceedings of the 2006 IEEE International Conference on
Conference_Location :
Luoyang, Henan
Print_ISBN :
1-4244-0465-7
Electronic_ISBN :
1-4244-0466-5
DOI :
10.1109/ICMA.2006.257600