DocumentCode
2865239
Title
Design and Fabrication of a Micro Electromagnetic Relay
Author
Liu, Bendong ; Li, Desheng
Author_Institution
Coll. of Mech. Eng. & Appl. Electron. Technol., Beijing Univ. of Technol.
fYear
2006
fDate
25-28 June 2006
Firstpage
480
Lastpage
484
Abstract
A new optimization structure for micro electromagnetic relay is introduced based on the research done before. Three-dimensional structure and new fabrication process is adopted accordingly in the improved design. The new structure can decrease the leak of magnetic circuit and increase the magnetic force. An optimization armature is introduced in order to improve the electromagnetic attract force and decrease the rigidity of the armature. A micro electromagnetic relay is fabricated based on the MEMS technology. The size of the micro electromagnetic relay is about 5 mm times 5 mm times 0.4 mm. The micro relay consists a lower magnetic circuit, a planar exciting coil and a permalloy cantilever. Anisotropic etching, electroplating, polyimide film patterning is adopted in the fabrication process. The exciting coil of the micro electromagnetic relay has 16 turns and the resistance of the coil is about 20 Omega. The initial experiments show that the permalloy cantilever displacement can reach 20 mum at a current and voltage of 250 mA and 5 V
Keywords
Permalloy; cantilevers; coils; electromagnetic devices; electromagnetic forces; electroplating; etching; microrelays; 20 ohm; 250 mA; 5 V; MEMS technology; anisotropic etching; electromagnetic attract force; electroplating; fabrication process; micro electromagnetic relay; optimization armature; permalloy cantilever; planar exciting coil; polyimide film patterning; Anisotropic magnetoresistance; Coils; Electromagnetic forces; Etching; Fabrication; Magnetic circuits; Magnetic forces; Micromechanical devices; Microrelays; Relays; MEMS; electromagnetic actuator; micro relay;
fLanguage
English
Publisher
ieee
Conference_Titel
Mechatronics and Automation, Proceedings of the 2006 IEEE International Conference on
Conference_Location
Luoyang, Henan
Print_ISBN
1-4244-0465-7
Electronic_ISBN
1-4244-0466-5
Type
conf
DOI
10.1109/ICMA.2006.257600
Filename
4026130
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